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heatsinks Press Releases

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By Advanced Thermal Solutions, Inc.
Engineers can now get faster, more detailed price quotes for heat sinks from Advanced Thermal Solutions, Inc. (ATS) by completing a simple online form that can be reached from every heat sink products page on the ATS website,
By Andrea Koss
A BGA component on a crowded circuit board required a low-cost heat sink that would manage excess heat and function in a confined space without the benefit of cooling air from a fan. A heat sink solution was provided by ATS, Inc.
By Advanced Thermal Solutions, Inc.
ATS is now providing heat sink design services to thermally manage 2nd generation Intel Core iProcessors with Sandy Bridge Microarchitecture being used in ATCA, blade servers and single board computers
By Andrea Koss
Linear maxiFLOW™ heat sinks from ATS extend the life and brightness of LEDs by removing excess heat from the dies that power the popular lighting devices. Their linear design allows cooling of multiple LEDs in displays and architectural lighting.
By Advanced Thermal Solutions, Inc.
An OEM of ATCA cabinets recently resolved the thermal issue of a BGA whose die temperature was exceeding the high end of its safe operating range. The thermal problem was eliminated by attaching economical straight fin heat sink
By Advanced Thermal Solutions, Inc.
ATS’s QPedia is proud to be a Media Sponsor of Electronics Thermal Week, co-sponsored by MEPTEC and SEMI-THERM. Three thermal management meetings are co-located: The Heat is On, SEMI-THERM and the JEDEC JC15 Committee on Thermal Standards
By Advanced Thermal Solutions, Inc.
ATS, inc., is presenting a free webinar: Heat Sink Materials: Choices and Tradeoffs on March 24 at 2 pm EST. The guest speaker is noted materials authority, Dr. Carl Zweben, Ph. D.
By Advanced Thermal Solutions, Inc.
Advanced Thermal Solutions has expanded its line of maxiFLOW™ heat sinks for cooling BGAs and other hot components in electronic systems. Available with thermal tape, superGRIP™ or maxiGRIP™ clips.
By Advanced Thermal Solutions
A leading telecommunications OEM asked ATS (Advanced Thermal Solutions, Inc.) to solve a persistent excess heat problem on their new PCB. ATS redesigned the thermal management solution, improving its efficiency and reducing its cost by 40%
By Advanced Thermal Solutions, Inc.
ATS, Inc. recently proved to two Tier 1 telecommunications equipment OEMs that it’s maxiFLOW™ heat sink design with superGRIP™ heat sink clip can make 4G telecommunications systems operate as designed
By ATS MarComm
April 16, 2010: Advanced Thermal Solutions (ATS) has introduced the ATS-56002 maxiFLOW® heat sink which is specially designed for cooling hot ASICS in narrow packages where space and airflow are limited.
By ATS MarComm
The HFC-100™ heat flux controller from Advanced Thermal Solutions (ATS) provides automatic calculation of total thermal resistance. It can be used to characterize the cooling capacity of cold plates.
By ATS Marketing Department
maxiFLOW high performance heat sinks and their patented maxiGRIP attachment from ATS can now be ordered through the Aavid Thermalloy website
By Advanced Thermal Solutions, Inc. (ATS)
maxiFLOW™ extended linear heat sinks reduce the intensity of heat generated by high output LEDs to ensure maintenance-free, ultra long service life.
By aluminum extrusion heatsinks
we offer OEM services for aluminum extrusion products,our main products are heatsinks

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